MIL-PRF-83383E
6.5 Definitions. For the purpose of this specification, the following definitions apply.
6.5.1 Tripping time (see 3.4.3 and 3.7). Tripping time is the total interval of elapsed time from the instant of
applying a given overcurrent to the RCCB to the completion of the interruption of the circuit.
6.5.2 Tripping time delay (see 3.4.3). Tripping time delay is the delay factor purposely designed into the tripping
time of an RCCB.
6.5.3 Line terminal (see 3.4.5.1). The terminal attached to the isolated stationary main contact of the RCCB with
the breaker in the open or tripped position is considered the line terminal. If both main contacts of the circuit are
isolated, only one terminal is to be designated the line terminal.
6.5.4 Auxiliary contacts (see 3.4.5.2). Auxiliary contacts are those mechanically interlocked with and operated by
the main contacts of the RCCB, and intended for use in monitoring circuits for signaling, electrical interlocking, or
other purposes.
6.5.5 Ultimate trip current (see 3.7). Ultimate trip current is the smallest value of current that causes tripping of the
RCCB under a given set of ambient conditions.
6.5.6 Ultimate trip limits (see 3.7). The specified limits of ultimate trip currents are maximum ultimate trip current
and minimum ultimate trip current. At the maximum specified ultimate trip current, the RCCB opens within the
specified time, and at the minimum specified ultimate trip current the RCCB does not open.
6.5.7 Available short circuit and close-up interrupt capacity tests. Tests using a voltage regulated circuit in which
the calibrated fault current is obtained after the regulator has provided maximum excitation.
6.5.8 Instantly available short circuit and close-in interrupt capacity tests. Tests during which the calibrated fault
current is essentially constant from fault application to interruption. This type of test is generally conducted with a
fixed excitation power supply.
6.5.9 Instantly available intermediate short circuit close-in interrupt capacity tests. Tests in which the fault current
is limited by resistance and is essentially constant from fault application to interruption.
6.5.10 Bimetal. Two metals, each having a different temperature coefficient of expansion, attached together to
form a bending motion with a change of temperature.
6.5.11 Discrete semiconductor. Those semiconductor devices having a single functional characteristic; i.e., diode,
transistor, SCR, FET, etc., and are acquired in conformance to specified performance criteria.
6.5.12 Monolithic microcircuit (or integrated circuit). A microcircuit consisting exclusively of elements formed on or
within a single semiconductor substrate with at least one of the elements formed within the substrate.
6.5.13 Hybrid microcircuit. A microcircuit consisting of elements which are a combination of the film microcircuit
type (see 6.5.14) and the semiconductor types (see 6.5.11 and 6.5.12) or a combination of one or both of the types
with discrete parts.
6.5.14 Film microcircuit. A microcircuit consisting exclusively of elements which are films formed
in-situ upon or within an insulating substrate.
6.6 Warning.
6.6.1 Potential test procedure hazards. Potentially hazardous situations are inherent in some of the test
procedures specified in this specification. Precautions should therefore be taken to insure that test personnel are
adequately protected and observe the necessary safety measures at all times.
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